The E-beam system is very similar in design to the sputtering system. The system has the following features:
• The system contains four material pockets for deposition of single and multilayers and alloys.
• System can reach a base pressure ~ 5 x 10-9 Torr.
• The system can handle 4 inch substrates which can be rotated and heated up to 850°C.
• The system also has a load lock chamber for quick removal and insertion of samples.