Skip to:
Skip to content
Skip to navigation
MRFN Member Login
Username
*
Password
*
Request new password
Program Application
Materials Research Facilities Network
Search form
Search
MRFN
Centers
Facilities
Instruments
Instrument types
People
Training Materials
About MRFN
Tools on MRFN.org
Program Application Form
Contact MRFN
MRFN Workshops
NSF MRSEC Facilities Satellite & MRFN Workshop 2018
MRFN Workshop 2018
MRFN Workshop 2011
Other DMR Sites
MRSEC
PREM
You are here
Home
University of Wisconsin-Madison
Materials Research Science and Engineering Center on Structured Interfaces
The Nanoscale Fabrication Center (NFC)
More details about this Instrument
Die Attacher
Make / Model :
MEI-720
Attaches IC dies to packaging using a film of eutectic alloy. Temps up to 500 C.
Remote Access to Instrument:
No
News
Shared instrumentation facilities: Benefiting researchers and universities, and sustaining research excellence
Making the Best of a Bad Situation: A Characterization Seminar Series
How NSF's Materials Research Facilities Network helps bolster the field of materials science and engineering
Read Other News
MRFN.org is supported by the MRSEC Program of the National Science Foundation. Image in the header is courtesy of CRISP MRSEC.
