Our dual-beam FIB system combines a gallium ion beam column with a SEM column to provide a versitile instrument for preparing cross-sectioned samples and thin TEM slices. The electron column allows the user to view and move the substrate without damage, and the ion beam is used for cutting, milling and metal deposition. The tool is equipped with a source of platinum for patterning of wires or protection patches, and with a source of XeF2 for rapid etching of silicon, nitrides and oxides. An Omniprobe manipulator allows the user to lift out TEM samples and to place them in situ on TEM grids.
| Accel. voltage | 30 kV |
| Electron resolution @30kV | 20 nm |
| Ga ion resolution | 50 nm |
MRFN.org is supported by the MRSEC Program of the National Science Foundation. Image in the header is courtesy of CRISP MRSEC.
