The Critical Point Dryer is capable of drying various size wafers (maximum of 6 inches) down to 1 square cm pieces. Liquid carbon dioxide replaces the solvent used in the last rinse process. The pressure and heat are then increased to change the liquid carbon dioxide to a gas. The pressure is slowly decreased to atmosphere thereby not allowing carbon dioxide to condense. The lack of the liquid/vapor stage allows for hte minimizing of stiction in beam release.