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Program Application

DC Sputter

Make / Model : 

Perkin Elmer 2400


The sputtering system is used to deposit Aluminum, Platinum or Titanium films onto substrates. This occurs when high voltage is passed into the vacujm chamber an dionizes the Argon gas within. These positively charged Argon atoms strike the metal target at the top of the chamber and the "newly freed" metal particle deposit on teh substrate resting below.