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The SB6 Bonder is capable of silicon fusion, anodic, and eutectic bonding. The system can handle 2-3 four inch wafers with minor Z axis adjustment. There are two separate heads; one for anodic bonding, and another for fusion bonding. The web site will indicate the current head in the machine. IF a different head is needed, arrangements need to be made 2 weeks in advance of system use through the Nano Fabrication Staff.