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Hysitron TI950 Triboindenter

Instrument types

The Hysitron TI 950 TriboIndenter is the next generation nanomechanical test instrument providing industry-leading sensitivity and unprecedented performance. The TI 950 nano-indenter has been developed as an automated, high throughput instrument to support the numerous nanomechanical characterization techniques developed by Hysitron. The TI 950 nano-indenter system incorporates the newly developed performech® Advanced Control Module, which greatly improves the precision of feedback-controlled nanomechanical testing, provides dual head testing capability for nano/micro scale connectivity, and offers unprecedented noise floor performance. The numerous nanomechanical testing techniques currently offered, as well as new testing methods currently being developed, make the TI 950 nano-indenter system an exceptionally versatile and effective nanomechanical characterization tool for the broadest range of applications.

Combine the TI 950 nano-indenter with Hysitron's xSol High Temperature Stage for quantitative, accurate, and reliable nanomechanical characterization at elevated temperatures up to 800 °C.

Integrated with low-noise three-plate capacitive transducers and electronics, the multi-layered enclosure and active vibration isolation system provide excellent environmental separation for the instrument.

The TI 950 TriboIndenter includes an integrated temperature/humidity sensor and all-digital color optics that connect to the data acquisition computer via a simple and reliable 1394-IEEE cable.


Hysitron's TI 950 TriboIndenter Features:

  • Hysitron’s uniquely patented in situ SPM imaging as standard
  • performech Advanced Control Module with DSP technology
  • Dual head testing capability for true nano/micro scale connectivity
  • 26x faster feedback for superior control
  • New custom engineered enclosure for greater environmental stability
  • Increased force sensitivity with a <30 nN noise floor for unprecedented accuracy
  • Active vibration isolation system
  • Integrated temperature/humidity sensor
  • All-digital color optics interfaced with a 1394-IEEE cable
  • Enhanced lateral measurements for ultra-thin film tribological characterization
  • Intelligently programmed software with enhanced testing routines
  • Faster sample approach and settle time for high throughput testing