This system is used to stamp a pattern into a polymer coating on a substrate. A stamp made of nickel or silicon is placed in the chamber. The substrate is placed on the substrate holder. The substrate is heated and the stamp is pressed into the polymer. The substrate is then cooled and the stamp released. Maximum heating capability is 250ºC. Most processes are done in the range of 5ºC to 200ºC. The stamp pressure is capable of a 70 bar maximum with most work done in the 12 to 15 bar range. Allowable substrate sizes are 2.5 inches in diameter or smaller.