The 950B, usually referred to as the “scanner” is configured for 6 inch wafers. It has a numerical aperture of 0.63. Its light source is a Cymer ArF 10W Excimer Laser that generates light at 193 nm wavelength. It utilizes fused silica reticles that are 6 inches square and 0.250 inches thick. It can print a 26 mm by 32 mm field in one flash. Specified resolution is 130 nm, but smaller dimensions can be achieved in research mode. It has an Aerial II illumination system that is usually operated in annular mode, but it is capable of conventional illumination.

The GCA 8500DSW stepper has a 16mm lens with 5x reduction and a numerical Aperture (NA) of 0.35, and uses a mercury arc lamp with a wavelength of 365nm. It is capable of exposing 3", 4" and 6" wafers. It has an automatic wafer handler that can be used for 6" notched wafers. The quartz reticles used in the stepper are 5"x 5" and 0.09" thick.

The MJB3 aligner used with samples up to 3” in diameter. Maximum mask size is 4” square. It operates in the wavelength range of 280-350 nm. The MA6 aligner can do both front and backside alignment for wafer pieces up through 6" wafers.

The Laurell Spinner is a multi-step programmable spinner that can accommodate pieces as well as 4 and 6 inch wafers. It is paired with two programmable hotplates in the same hood.

The Nano eNabler™ system is a highly flexible molecular printer that can dispense minute volumes of liquid at defined positions to create patterns of spots or lines with high spatial accuracy.

This system is used to stamp a pattern into a polymer coating on a substrate. A stamp made of nickel or silicon is placed in the chamber. The substrate is placed on the substrate holder. The substrate is heated and the stamp is pressed into the polymer. The substrate is then cooled and the stamp released. Maximum heating capability is 250ºC. Most processes are done in the range of 5ºC to 200ºC. The stamp pressure is capable of a 70 bar maximum with most work done in the 12 to 15 bar range. Allowable substrate sizes are 2.5 inches in diameter or smaller.

The PM-600 is a RF plasma barrel reactor designed for stripping, etching and cleaning. The gas used is Oxygen.

This is a multi-wafer system, which can handle wafer sizes up to 8" in diameter. The tool is used to primarily deposit aluminum and titanium, however, other metals may also be considered provided cross-contamination is not a concern.

This tool is primarily used to etch silicon dioxide and silicon nitride. Gases available include Argon, Oxygen, Sulfur Hexafluoride (SF6) and Trifluoromethane (CHF3).

The Develop Track is an SVG 90-SE develop track for 6 inch wafers. It has two develop modules and two hotplates and chill plates. It is plumbed with MF-319 developer, but has the capability of dispensing two different develop chemistries.

The system is a single-wafer epitaxy reactor with the capability of processing Si wafers as large as 8′′ wafers (It is also downward compatible with 4 and 6′′ wafers)