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Johns Hopkins University
Materials Research Science Engineering Center
Fabrication and Processing
Instrument Technical Primary Contact:
Chia-Ling Chien
More details about this Instrument
Kulicke & Soffa 4523 Wire Bonder
Instrument types
Wire Bonding
Make / Model :
Kulicke & Soffa 4523
Features:
30 and 45 degree wedge bonder
25, 75 micron wire
50 micron pad size
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