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Program Application

Fabrication and Processing

Instruments

  1. Class 1000 Cleanroom

     

    Features:

  2. Dual-Source Thermal Evaporators

  3. Electron-Beam Lithography

     

    Features:

    • 0.1 micron feature size
    • Multiple-mask alignment with 0.5 micron accuracy

  4. FEI Nova 600 Dual-Beam Focused Ion Beam System

  5. Irraditation Chamber for Nuclear Particle Tracks

  6. Kulicke & Soffa 4523 Wire Bonder

     

    Features:

    • 30 and 45 degree wedge bonder
    • 25, 75 micron wire
    • 50 micron pad size

  7. Lambda-Physik Pulsed Laser Deposition System

  8. Lindberg/Blue Tri-Arc Furnace

  9. Mask Aligner

    Features:

    • Contact photolithography across 3'' wafer with 2 micron feature size
    • Multiple-mask alignment with 2 micron accuracy

  10. Multilayer Electrochemical Deposition System

  11. Multiple-Source Supttering Chambers

    Features: 

    • 4, 6 source systems with 2-inch targets
    • DC and RF magnetron sputtering
    • Computer-controlled multilayer deposition system

  12. Projection Photolithography

    0.5 micron feature size

  13. Tubular Furnaces (up to 1500 C)