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Leica EM TiC 3X Ion Beam Milling System

Instrument types

The Wisconsin Centers for Nanoscale Technology installed a Leica EM TiC 3X Ion Beam milling system. Funding was provided by the UW-Madison MRSEC, COE, L&S, VCRGE and CALS. The system is currently available for use in the Nanoscale Imaging and Analysis Center.

Features

  • The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar¬†surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations
  • With the EM TIC 3X you achieve high quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in as near a native state as possible