Allows for a highly anisotropic etch precess used to create deep, steep sided holes in substrates
Chapel Hill Analytical and Nanofabrication Laboratory (CHANL) houses facilities for materials characterization and a versatile suite of instrumentation for micro and nanofabrication.
Allows for a highly anisotropic etch precess used to create deep, steep sided holes in substrates
E-beam evaporation for high quality metal films
Used to obtain secondary & backscatter electron images of materials, polymers and biological samples at relatively low pressures (upto 5 Torr).
The dual electron and ion beam system allows for simultaneous SEM imaging and ion beam patterning (selective removal or addition of material).
Embosses a mold into a thermoplastic material at temperatures above its glass transition temperature with an applied force.
The Resonetics Rapid X250 uses a pulsed laser to ablate material according to the CAD file provided.
The mask aligner allows you to expose a photoresist through a mask to generate a pattern.
The PVD 75 magnetron sputtering system is used for deposition of metals and metal oxides.
The AutoGlow system is used for etching and cleaning surfaces or for surface activation processes.
The PECVD system can deposit low stress silicon nitride and silicon dioxide films.
Deposits uniform thin films by focusing a high power pulsed laser beam on a target of the desired composition to vaporize the target material and deposited it as a thin film on a substrate.
Used to obtain a three dimensional image of a sample on the nanometer to micron scale.
The P-6 Stylus profiling system provides high resolution 2D and 3D analysis of surface topography. The analysis software can calculate a variety of surface parameters including step height, surface roughness and waviness.
Used to measure thickness of dielectrics, semiconductors, and thin (~10nm) metal films.
Used to create thin sections of a sample for SEM or TEM imaging.