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Johns Hopkins University
Materials Research Science Engineering Center
Fabrication and Processing
Instrument Technical Primary Contact:
Daniel Reich
Mask Aligner
Instrument types
Lithography
Features:
Contact photolithography across 3'' wafer with 2 micron feature size
Multiple-mask alignment with 2 micron accuracy
News
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MRFN.org is supported by the MRSEC Program of the National Science Foundation. Image in the header is courtesy of CRISP MRSEC.