Cambridge Fiji F200 Atomic Layer Deposition with current capabilities that include Al2O3, Alumina, HfO2, Pt, SiO2, and Ti.
The Utah Nanofab encompasses a class 100/1000/10,000 cleanroom, packaging, and test areas. Commissioned in 2012, the new 18,000 square foot facility provides the specialized custom-built infrastructure, equipment, processes, and expertise necessary for researchers and companies to design, build, and package prototype micro- and nano-scale devices including microfluidic devices. Capabilities include device modeling, design layout, mask fabrication, thin film deposition, patterning, and device packaging including laser microwelding.
The facility and staff serves researchers and companies from the campus and beyond, including faculty and researchers from regional institutions as well as companies who use the facilities to generate proof-of-concept and data supporting new product ideas.
Visionary ideas and inspired creativity have helped the Utah Nanofab become a world leader in the fabrication of neural prosthetics, biomedical microfluidic systems and biosensor chips. The discoveries made in the Nanofab help create life-saving medical devices, faster microchips, and more efficient energy systems, resulting in many scientific publications and new companies. Visit our history page to learn that our roots go all the way back to the fundamental patent on CMOS microelectronic devices.
Cambridge Fiji F200 Atomic Layer Deposition with current capabilities that include Al2O3, Alumina, HfO2, Pt, SiO2, and Ti.
Electronic Vision EV420 Contact Aligner with top and bottom side alignment.
Suss MA 1006 Contact Aligner with top and bottom side alignment.
OAI Hybralign Series 200 Contact Aligner.
Cascade RF1-CM1 Electrical Probe station for device characterization.
Strasbaugh 6EC Chemical Mechanical Polishing System
Keithley System for measuring capacitance voltage
Disco DAD641 Programmable Dicing Saw
Disco DAD3320 Automatic Dicing Saw
Canary Noble IV Atmospheric Furnace for Boron or Phosphorous Doping, Diffusion, and Annealing.
Denton SJ20C E-beam evaporator with Al, Ag, Au, Au/Ge, Cr, Cu, Ge, In, Mo, Nb, Ni, NiCr, Ta, Ti, W, and Zn available.
CHA SEL 600 E-beam evaporator used primarily for Al.
Keithley 4200 Electrical Probe station for device characterization.
Optec Micromaster KrF Excimer Laser Micromachining System
Heidelberg uPG101 Laser Pattern Generator System for Chromium Masks or Direct Wafer writing.
Lasermark LM-4000 Nd-YAG Laser Marking/Micromachining System
Expertech CTR-125 LPCVD Furnace with auto-load cantilever for Phosphorous-Doped or Undoped Amorphous or Polycrystalline Silicon Deposition.
Expertech CTR-125 LPCVD Furnace with auto-load cantilever for Low Temperature Oxide or PhosphoSilicate Glass Deposition.
Canary Noble IV LPCVD Furnace for Stoichiometric or Low Stress (Si-Rich) Nitride Deposition.
Expertech CTR-125 LPCVD Furnace with auto-load cantilever for Stoichiometric or Low Stress (Si-Rich) Nitride Deposition.
Canary Noble IV LPCVD Furnace for Amorphous or Polycrystalline Silicon Deposition.
Expertech CTR-125 LPCVD Furnace with auto-load cantilever for TEOS Deposition.
Binder FD53-UL Oven for photoresist baking/curing.
YES LP-III HMDS Vapor Prime Oven
Canary Noble IV Atmospheric Furnace for Dry or Wet (Pyrogenic) Oxidation.
Speciality Coating Systems PDS 2010 Parylene Coater for deposition of Parylene-C films.
Oxford 80+ PECVD chamber capable of depositing Si3N4, SiONx, and SiO2 films.
Oxford 100 ICP Deep Reactive Ion Etcher capable of high aspect ratio silicon etch.
Technics PE-IIA Oxygen Plasma Etcher.
STS Aspect Deep Reactive Ion Etcher capable of high aspect ratio silicon etch.
Xactix X2 Xenon Difluoride Dry Isotropic etcher for silicon etching.
Oxford 80+ Reactive Ion Etcher with Ar, CF4, CXl2, O2, and SF6 gases available.
Brewer CEE 100 Series table-top Spin Coater for substrates up to 6" diameter.
Solitec 5100 Series stand-alone Spin Coater for substrates up to 9" diameter.
Brewer CEE 200 Series table-top Spin Coater for substrates up to 6" diameter.
Brewer CEE 200X Series stand-alone spin develop or etch system for substrates up to 6" diameter.
Denton Discovery 18 Sputtering System with 3 target capacity, 2 RF sources, substrate rotation and heat.
TMV Super Series with 6 cathodes (Au, Cr, Ir, Pt, Ti, and TiW) and four 6" rotating substrate holders.
KLA-Tencor P-10 Surface Profilometer
KLA-Tencor P-20 Surface Profilometer
KLA-Tencor Flexus 2320 laser-based system for measuring stress of thin films through changes in radius of curvature.
Nanospec 3000 Reflectometer for measuring thickness of thin films.
n and k 1500 Spectrophotometer for measuring thickness of thin films with automatic stage and mapping capability.
Electronic Vision EVG 520IS System for Anodic Wafer Bonding.
Multiple Wet Benches, Fume Hoods, and Spin/Rinse/Dryers with various chemistries available.
MEI 1204W Wire/Wedge Bonder
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