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Imaging and Characterization Facility

The Center for Research on Interface Structure and Phenomena (CRISP) facilities include core shared instrumentation of the YINQE laboratory in the Malone Engineering Center, This core facility includes SEM, TEM, FIB, AFM, and electron-beam lithography. Check out The YINQE web page for a complete description. CRISP has several more specialized instruments in Becton Center.

CRISP facilities in the Becton Engineering Center include tools for x-ray diffraction, x-ray photoelectron spectroscopy, and SQUID magnetometry.

The more specialized instruments are used to grow thin films using oxide molecular beam epitaxy (MBE). These tools can grow materials with a precision of an atomic layer. Yale has the highest concentration of oxide MBE tools in the world and makes contributions toward next-generation electronic devices.





  1. Bruker Fastscan AFM

    The Bruker Fastscan provides atomic force microscopy in peak-force, tapping or contact mode for imaging in both air and fluid. Mechanical properties such as stiffness and adhesion can be measured and mapped.

  2. Bruker multimode AFM


    The Bruker (Digital Instruments) multimode AFM with a 1 cm sample stage provides high-resolution microscopy with a simple tip changing procedure.

  3. Denton Desk V chromium sputtering tool


  4. FEI Tecnai Osiris 200kV TEM for material science

  5. FEI XL40 SEM


  6. Fischione 1050 TEM thinning mill

  7. Hitachi SU-70 high resolution SEM


  8. KLA Tencor Alphastep 200 profilometer

  9. Leica Cryo-Microtome

  10. Rotating Anode X-Ray Source

  11. Vistec EBPG 5000+ electron-beam lithography